@prefix dcat: <http://www.w3.org/ns/dcat#> .
@prefix dct: <http://purl.org/dc/terms/> .
@prefix foaf: <http://xmlns.com/foaf/0.1/> .
@prefix gsp: <http://www.opengis.net/ont/geosparql#> .
@prefix locn: <http://www.w3.org/ns/locn#> .
@prefix vcard: <http://www.w3.org/2006/vcard/ns#> .
@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .

<https://data.amerigeoss.org/dataset/11057e6c-d149-4571-9ca4-10bb1f64c62b> a dcat:Dataset ;
    dct:description "Pushing the boundaries with geothermal tool development can often necessitate exceeding manufacturer specifications for temperature and pressure of individual circuit components. Detailed here are the efforts surrounding geothermal temperature characterization of commercially available HT-Flash memory modules made by Texas Instruments (SM28VLT32-HT) and preliminary results of 3 commercial solid tantalum capacitors. Flash evaluation boards were modified for high temperature application and read, write and erase functionality were tracked as well as prolonged data retention at various temperatures well beyond datasheet specifications." ;
    dct:identifier <https://data.openei.org/submissions/3372> ;
    dct:issued "2015-10-28T06:00:00+00:00"^^xsd:dateTime ;
    dct:modified "2017-07-18T19:52:31+00:00"^^xsd:dateTime ;
    dct:publisher <https://data.amerigeoss.org/organization/727dbdd5-3f98-4ac0-9d28-5e344558139b> ;
    dct:spatial [ a dct:Location ;
            locn:geometry "POLYGON ((-106.5839 35.0453, -106.5839 35.0453, -106.5839 35.0453, -106.5839 35.0453, -106.5839 35.0453))"^^gsp:wktLiteral ] ;
    dct:title "HT Flash and Tantalum Capacitor Report" ;
    dcat:contactPoint [ a vcard:Organization ;
            vcard:fn "Avery Cashion" ;
            vcard:hasEmail <mailto:atcashi@sandia.gov> ] ;
    dcat:distribution <https://data.amerigeoss.org/dataset/11057e6c-d149-4571-9ca4-10bb1f64c62b/resource/df656dcb-6eac-4b0a-bc7e-dbc80f27bce0> ;
    dcat:keyword "amerigeo",
        "amerigeoss",
        "capacitor",
        "ckan",
        "component-testing",
        "components",
        "downhole",
        "electronics",
        "flash",
        "flash-memory",
        "geo",
        "geoss",
        "geothermal",
        "geothermal-tools",
        "high-temp",
        "high-temperature",
        "ht",
        "ht-components",
        "limitations",
        "manufacturer",
        "national",
        "north-america",
        "pressure",
        "specifications",
        "tantalum",
        "technology",
        "temperature",
        "tool-development",
        "united-states" .

<https://data.amerigeoss.org/dataset/11057e6c-d149-4571-9ca4-10bb1f64c62b/resource/df656dcb-6eac-4b0a-bc7e-dbc80f27bce0> a dcat:Distribution ;
    dct:description "Report of high temperature flash and tantalum capacitor evaluations beyond manufacturer specifications." ;
    dct:format "PDF" ;
    dct:issued "2022-08-08T11:30:59.727557"^^xsd:dateTime ;
    dct:modified "2025-11-20T01:22:03.591200"^^xsd:dateTime ;
    dct:title "High-Temp Component Evaluation.pdf" ;
    dcat:accessURL <https://gdr.openei.org/files/612/Cashion_Cieslewski_HT%20Flash%20and%20Capacitor%20Evalutations-HiTEN_Submission.pdf> ;
    dcat:mediaType "application/pdf" .

<https://data.amerigeoss.org/organization/727dbdd5-3f98-4ac0-9d28-5e344558139b> a foaf:Agent ;
    foaf:name "US Migrating" .