@prefix dcat: <http://www.w3.org/ns/dcat#> .
@prefix dct: <http://purl.org/dc/terms/> .
@prefix foaf: <http://xmlns.com/foaf/0.1/> .
@prefix vcard: <http://www.w3.org/2006/vcard/ns#> .
@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .

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    dct:description "<p>Integration of a mix of heterogeneous electronic device technologies (silicon, III-V, passive, etc.) into a single multifunctional substrate core. Based on the development&nbsp; and implementation of 2.5D and 3-D interconnect and interposer packaging technologies.&nbsp; Target small sat deep space transponder/RF comms boards into one board for &gt;50% size and weight savings.</p> <p>A custom multifunctional core substrate scheme comprised of next generation polyimide, ceramic and/or silicon materials will be designed to integrate new 2.5D and 3-D interconnect technologies into producing a significant size and power reduced RF transponder.&nbsp; Development of heterogeneous flip chip attachment to low loss substrates, embedded RF waveguides and passives (R,L,C) and completely plug in/stackable Multichip Modules (MCM) will be required to meet this goal.</p>" ;
    dct:identifier "TECHPORT_16825" ;
    dct:issued "2017-10-01"^^xsd:date ;
    dct:modified "2020-01-29"^^xsd:date ;
    dct:publisher <https://data.amerigeoss.org/organization/727dbdd5-3f98-4ac0-9d28-5e344558139b> ;
    dct:title "Multifunctional Electronics Core Substrate Configurable Electronics Functionality with Stacked Silicon and Multi-Chip Modules" ;
    dcat:contactPoint [ a vcard:Organization ;
            vcard:fn "TECHPORT SUPPORT" ;
            vcard:hasEmail <mailto:hq-techport@mail.nasa.gov> ] ;
    dcat:distribution <https://data.amerigeoss.org/dataset/1d9f6508-df96-47ed-b699-48d970ad98ea/resource/2b8be958-5455-4b08-bae3-c2306f98809f>,
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        "ckan",
        "geo",
        "geoss",
        "jet-propulsion-laboratory",
        "national",
        "north-america",
        "united-states" .

<https://data.amerigeoss.org/dataset/1d9f6508-df96-47ed-b699-48d970ad98ea/resource/2b8be958-5455-4b08-bae3-c2306f98809f> a dcat:Distribution ;
    dct:description "Techport Project JSON Metadata" ;
    dct:format "HTML" ;
    dct:issued "2020-11-12T04:24:07.363408"^^xsd:dateTime ;
    dct:modified "2025-11-20T08:20:06.176400"^^xsd:dateTime ;
    dct:title "Multifunctional Electronics Core Substrate Configurable Electronics Functionality with Stacked Silicon and Multi-Chip Modules" ;
    dcat:accessURL <https://techport.nasa.gov/api/projects/16825> ;
    dcat:mediaType "text/html" .

<https://data.amerigeoss.org/dataset/1d9f6508-df96-47ed-b699-48d970ad98ea/resource/2e3413b8-b73a-41aa-8c4a-db4ed1c69c9f> a dcat:Distribution ;
    dct:description "Techport Project XML Metadata" ;
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    dct:issued "2020-11-12T04:24:07.363411"^^xsd:dateTime ;
    dct:modified "2025-11-20T08:20:06.176792"^^xsd:dateTime ;
    dct:title "Multifunctional Electronics Core Substrate Configurable Electronics Functionality with Stacked Silicon and Multi-Chip Modules" ;
    dcat:accessURL <https://techport.nasa.gov/api/projects/16825.xml> ;
    dcat:mediaType "text/html" .

<https://data.amerigeoss.org/dataset/1d9f6508-df96-47ed-b699-48d970ad98ea/resource/750d370d-0f24-497e-b4bb-d5ab585091b3> a dcat:Distribution ;
    dct:description "Techport Project Page" ;
    dct:format "HTML" ;
    dct:issued "2020-11-12T04:24:07.363401"^^xsd:dateTime ;
    dct:modified "2025-11-20T08:20:06.175984"^^xsd:dateTime ;
    dct:title "Multifunctional Electronics Core Substrate Configurable Electronics Functionality with Stacked Silicon and Multi-Chip Modules" ;
    dcat:accessURL <https://techport.nasa.gov/view/16825> ;
    dcat:mediaType "text/html" .

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    dct:description "Techport Project PDF Export" ;
    dct:format "HTML" ;
    dct:issued "2020-11-12T04:24:07.363414"^^xsd:dateTime ;
    dct:modified "2025-11-20T08:20:06.177170"^^xsd:dateTime ;
    dct:title "Multifunctional Electronics Core Substrate Configurable Electronics Functionality with Stacked Silicon and Multi-Chip Modules" ;
    dcat:accessURL <https://techport.nasa.gov/datasheet/16825> ;
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