Data for Advanced Metrology Suite for Linking Residual Stress to FundamentalProperties of Thermoset Packaging Materials

This repository contains data generated to support and ECTC 2025 conference manuscript titled "Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging Materials". It contains differential scanning calorimetry (DSC), rheology, digital image correlation (DIC), vapor uptake, and stress bench data on and example commercially available encapsulant epoxy material. The goal of the study and data is to (a) demonstrate these techniques, and (b) better understand the cure kinetics, liquid-to-solid transition, and residual stresses in for this material system. More complete descriptions of the methods and finding are available in the associated manuscript.The dataset contain about 2.5 GB of data, most of which by size is DIC images in .7z compressed folders. Most data is provided in .csv, .xslx, and .mat files. Resultant figures are included for reference in .png, .tiff or similar formats.

Data and Resources

Field Value
accessLevel public
bureauCode {006:55}
catalog_@context https://project-open-data.cio.gov/v1.1/schema/data.json
catalog_conformsTo https://project-open-data.cio.gov/v1.1/schema
catalog_describedBy https://project-open-data.cio.gov/v1.1/schema/catalog.json
identifier ark:/88434/mds2-3698
issued 2025-02-06
landingPage https://data.nist.gov/od/id/mds2-3698
language {en}
license https://www.nist.gov/open/license
modified 2025-01-30 00:00:00
programCode {006:045}
publisher National Institute of Standards and Technology
resource-type Dataset
source_datajson_identifier true
source_hash 04f83aa037e5354f9bcffeab33f7106c15d27610a9aefb16547b72766841009f
source_schema_version 1.1
theme {"Metrology:Optical, photometry, and laser metrology","Metrology:Flow metrology and rheology",Materials:Polymers,"Materials:Materials characterization"}
Groups
  • AmeriGEOSS
  • National Provider
  • North America
Tags
  • AmeriGEO
  • AmeriGEOSS
  • CKAN
  • GEO
  • GEOSS
  • National
  • North America
  • United States
  • cure-kinetics
  • cure-shrinkage
  • differential-scanning-calorimetry
  • digital-image-correlation
  • encapsulant
  • epoxy
  • residual-stress
  • rheology
  • thin-film-stress
  • vapor-saturation
isopen False
license_id other-license-specified
license_title other-license-specified
maintainer Alexander Landauer
maintainer_email alexander.landauer@nist.gov
metadata_created 2025-09-23T17:03:56.189542
metadata_modified 2025-09-23T17:03:56.189550
notes This repository contains data generated to support and ECTC 2025 conference manuscript titled "Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging Materials". It contains differential scanning calorimetry (DSC), rheology, digital image correlation (DIC), vapor uptake, and stress bench data on and example commercially available encapsulant epoxy material. The goal of the study and data is to (a) demonstrate these techniques, and (b) better understand the cure kinetics, liquid-to-solid transition, and residual stresses in for this material system. More complete descriptions of the methods and finding are available in the associated manuscript.The dataset contain about 2.5 GB of data, most of which by size is DIC images in .7z compressed folders. Most data is provided in .csv, .xslx, and .mat files. Resultant figures are included for reference in .png, .tiff or similar formats.
num_resources 122
num_tags 18
title Data for Advanced Metrology Suite for Linking Residual Stress to FundamentalProperties of Thermoset Packaging Materials