Monolithically integrated AlN/GaN electronics for harsh environments, Phase I
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| Field | Value |
|---|---|
| Groups |
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| Tags |
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| isopen | False |
| license_id | us-pd |
| license_title | us-pd |
| maintainer | TECHPORT SUPPORT |
| maintainer_email | hq-techport@mail.nasa.gov |
| metadata_created | 2025-12-02T08:17:01.034927 |
| metadata_modified | 2025-12-02T08:17:01.034931 |
| notes | Recently, resonant-tunneling-diode (RTD) based circuits employing monolithically-integrated RTD on high electron mobility (HEMT) structures have been developed in a number of III-V systems in order to improve operational speed. The main goal of this program is to develop wide temperature-operable radiation hard monolithically-integrated electronics based on wide bandgap III-nitride epitaxial structures. |
| num_resources | 4 |
| num_tags | 8 |
| title | Monolithically integrated AlN/GaN electronics for harsh environments, Phase I |