Multifunctional Electronics Core Substrate Configurable Electronics Functionality with Stacked Silicon and Multi-Chip Modules

Integration of a mix of heterogeneous electronic device technologies (silicon, III-V, passive, etc.) into a single multifunctional substrate core. Based on the development  and implementation of 2.5D and 3-D interconnect and interposer packaging technologies.  Target small sat deep space transponder/RF comms boards into one board for >50% size and weight savings. A custom multifunctional core substrate scheme comprised of next generation polyimide, ceramic and/or silicon materials will be designed to integrate new 2.5D and 3-D interconnect technologies into producing a significant size and power reduced RF transponder.  Development of heterogeneous flip chip attachment to low loss substrates, embedded RF waveguides and passives (R,L,C) and completely plug in/stackable Multichip Modules (MCM) will be required to meet this goal.

Data and Resources

Field Value
accessLevel public
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identifier TECHPORT_16825
issued 2017-10-01
landingPage https://techport.nasa.gov/view/16825
modified 2020-01-29
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  • North America
Tags
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  • amerigeoss
  • ckan
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  • geoss
  • jet-propulsion-laboratory
  • national
  • north-america
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maintainer TECHPORT SUPPORT
maintainer_email hq-techport@mail.nasa.gov
metadata_created 2025-11-20T08:20:06.183737
metadata_modified 2025-11-20T08:20:06.183741
notes <p>Integration of a mix of heterogeneous electronic device technologies (silicon, III-V, passive, etc.) into a single multifunctional substrate core. Based on the development&nbsp; and implementation of 2.5D and 3-D interconnect and interposer packaging technologies.&nbsp; Target small sat deep space transponder/RF comms boards into one board for &gt;50% size and weight savings.</p> <p>A custom multifunctional core substrate scheme comprised of next generation polyimide, ceramic and/or silicon materials will be designed to integrate new 2.5D and 3-D interconnect technologies into producing a significant size and power reduced RF transponder.&nbsp; Development of heterogeneous flip chip attachment to low loss substrates, embedded RF waveguides and passives (R,L,C) and completely plug in/stackable Multichip Modules (MCM) will be required to meet this goal.</p>
num_resources 4
num_tags 10
title Multifunctional Electronics Core Substrate Configurable Electronics Functionality with Stacked Silicon and Multi-Chip Modules