Reliable Direct Bond Copper Ceramic Packages...
URL: https://techport.nasa.gov/api/projects/8967.xml
Techport Project XML Metadata
Additional Information
| Field | Value |
|---|---|
| Data last updated | August 1, 2018 |
| Metadata last updated | December 2, 2025 |
| Created | August 1, 2018 |
| Format | HTML |
| License | us-pd |
| Datastore active | False |
| Has views | True |
| Id | 8f43466d-fb51-4427-9ea3-968aaaee3fd8 |
| Mimetype | text/html |
| Package id | fd5eaff3-7800-4e74-ae94-04e38c9047e4 |
| Position | 2 |
| State | active |
| Webstore last updated | None |
| Webstore url | None |