Reliable Direct Bond Copper Ceramic Packages for High Temperature Power Electronics, Phase I

The proposed program will develop highly reliable, hermetic, Si3N4 ceramic multichip modules to integrate commercially available SiC power devices to build power electronic modules for reliable operation above 500ºC in extreme environments of space exploration. The Phase I program will demonstrate a reliable direct bond copper (DBC) process for Si3N4 substrates, develop high current carrying hermetic feedthroughs, an innovative transient liquid phase (TLP) die attach, and a monometallic wire bonding capable of reliable operation above 500ºC; and fabricate and test a hermetic single-chip module.

Data and Resources

Field Value
Groups
  • AmeriGEOSS
  • National Provider
  • North America
Tags
  • amerigeo
  • amerigeoss
  • ckan
  • geo
  • geoss
  • national
  • north-america
  • united-states
isopen False
license_id us-pd
license_title us-pd
maintainer TECHPORT SUPPORT
maintainer_email hq-techport@mail.nasa.gov
metadata_created 2025-12-02T09:57:16.458003
metadata_modified 2025-12-02T09:57:16.458007
notes The proposed program will develop highly reliable, hermetic, Si3N4 ceramic multichip modules to integrate commercially available SiC power devices to build power electronic modules for reliable operation above 500ºC in extreme environments of space exploration. The Phase I program will demonstrate a reliable direct bond copper (DBC) process for Si3N4 substrates, develop high current carrying hermetic feedthroughs, an innovative transient liquid phase (TLP) die attach, and a monometallic wire bonding capable of reliable operation above 500ºC; and fabricate and test a hermetic single-chip module.
num_resources 4
num_tags 8
title Reliable Direct Bond Copper Ceramic Packages for High Temperature Power Electronics, Phase I