Fabrication Process and Electronics Development for Scaling Segmented MEMS DMs, Phase I

Microelectromechanical systems (MEMS) technology has the potential to create deformable mirrors (DM) with more than 10^4 actuators that have size, weight, and power specifications that are far lower than conventional piezoelectric and electrostrictive DMs. However, considerable development is necessary to take state-of-the-art DMs today and make them flight-like. This Phase I SBIR proposal addresses two critical areas in MEMS DM development towards the goal of developing flight-like hardware. Namely, Phase I research will further develop Iris AO's proven hybrid MEMS DM technology to: 1) make a critical assembly step in the fabrication process scalable to wafer scales and 2) increase drive electronics resolution to 16 bits while simultaneously reducing power requirements more than three-fold over existing 14-bit resolution electronics. The increased spatial and actuator resolution afforded by the development here will enable picometer resolution DMs required to reach 10^10 contrast levels necessary for direct detection of Earth-sized terrestrial planets.

Data and Resources

Field Value
Groups
  • AmeriGEOSS
  • National Provider
  • North America
Tags
  • amerigeo
  • amerigeoss
  • ckan
  • geo
  • geoss
  • national
  • north-america
  • united-states
isopen False
license_id us-pd
license_title us-pd
maintainer TECHPORT SUPPORT
maintainer_email hq-techport@mail.nasa.gov
metadata_created 2025-11-29T20:09:22.763703
metadata_modified 2025-11-29T20:09:22.763707
notes Microelectromechanical systems (MEMS) technology has the potential to create deformable mirrors (DM) with more than 10^4 actuators that have size, weight, and power specifications that are far lower than conventional piezoelectric and electrostrictive DMs. However, considerable development is necessary to take state-of-the-art DMs today and make them flight-like. This Phase I SBIR proposal addresses two critical areas in MEMS DM development towards the goal of developing flight-like hardware. Namely, Phase I research will further develop Iris AO's proven hybrid MEMS DM technology to: 1) make a critical assembly step in the fabrication process scalable to wafer scales and 2) increase drive electronics resolution to 16 bits while simultaneously reducing power requirements more than three-fold over existing 14-bit resolution electronics. The increased spatial and actuator resolution afforded by the development here will enable picometer resolution DMs required to reach 10^10 contrast levels necessary for direct detection of Earth-sized terrestrial planets.
num_resources 4
num_tags 8
title Fabrication Process and Electronics Development for Scaling Segmented MEMS DMs, Phase I