Program has resulted in significant technical accomplishments -High-temperature wafer process is in production -High-temperature design infrastructure (libraries/toolkits) in place -Precision Amplifier and FPGA design success on the 1stpass -Demonstrated High-temperature non-volatile memory capability -A-to-D design and fabrication complete, ready for evaluation ?Objectives to date are being met -Vote of confidence last fall with SOPO revision and additional funding from JIP partners and DOE -JIP is on-board for 2006 ?There is a clear path forward to achieve the program goals